binder solderable (cyna) sn60pb40 2.0/100

Application in the electronics industry
Diameter 2 mm
Weight 100 g
Alloy composition Sn60Pb40
Character solder wire
Binder type for soft soldering
Binder type lead
Melting point 190 ˚C
Current type F-SW26, Halide, Rosin, No Clean
Flux content 2.5%
Number of current cores 3

Fluxed solder, produced by primary melting of tin and lead according to PN EN 29453:2000, in a continuous casting process without air access, then extruded, which ensures the elimination of oxides.

binder with a thickness of 2.0 mm and a mass of 100 g, a tin content of 59.5-60.5% in the product and a melting point of 183-190 °C.
SW26 flux is made on the basis of rosin and an organic halogen activator, which after soldering is "stuck" in the rosin, so it does not come into direct contact with the solder and does not cause corrosion, it also promotes melting and increases the flowability of the solder.

Iodine binder is mainly used in the electronics industry, for the production of standard electronic devices and components, and in electrical engineering.
Purpose/Application

Solder is mainly used in the electronics industry, for the production of standard electronic devices and components, and in electrical engineering.

Technical specifications

unit: pc
diameter [mm]: 2
The binder cannot be used in devices that are not covered by the exceptions to the restriction included in the Directive 2011/65/EU of the European Parliament and the Council of June 8, 2011 (restriction of the use of certain hazardous substances in electrical and electronic equipment). (RoHS), as amended.

Delivery method